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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 30 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 2.7v to 5.5v input, 4.0a integrated mosfet single synchronous buck dc/dc converter BD9B400MUV general description bd 9b400muv is a synchronous buck switching regulator with built-in low on-resistance power mosfets. this ic, which is capable of providing current up to 4a, features fast transient response by employing constant on -time control system. it offers high oscillating frequency at low inductance. with its original constant on -time control method which operates low consumption at light load, this product is ideal for equipment and devices that demand minimal standby power consumption. features ? synchronous single dc/dc converter ? constant on -time control suitable to deep-sllm ? over current protection ? short circuit protection ? thermal shutdown protection ? under voltage lockout protection ? adjustable soft start ? power good output ? vqfn016v3030 package (backside heat dissipation) applications ? step-down power supply for dsps, fpgas, microprocessors, etc. ? laptop pcs/tablet pcs/servers ? lcd tvs ? storage devices (hdds/ssds) ? printers, oa equipment ? entertainment devices ? distributed power supply , secondary power supply key specifications ? input voltage range: 2.7v to 5.5v ? output voltage range: 0.8 v to v pvin x 0.8 v ? maximum operating current: 4a (max) ? switching frequency: 2mhz/1mhz (typ) ? high-side mosfet on resistance: 30m (typ) ? low -side mosfet on resistance: 30m (typ) ? standby current: 0 a ( typ) package(s) w (typ) x d (typ) x h (max) vqfn016v3030 3.00 mm x 3.00 mm x 1.00 mm typical application circuit figure 1. application circuit vqfn016v3030 en pvin boot freq b d 9 b 4 0 0 m u v pgd sw fb vin v out avin ss pgd mode agnd pgnd enable 22 ?f 0.1 ?f c ss r2 r1 0.1 ?f 22 ?f? 2 c fb 1.0 ?h datashee t downloaded from: http:///
2/ 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 pin configuration(s) pin description(s) pin no. pin name function 1, 2 pvin power supply terminals for the switching regulator. these terminals supply power to the output stage of the switch ing regulator. connecting a 22 f ceramic capacito r is recommended. 3, 4 pgnd ground terminals for the output stage of the switching regulat or. 5 agnd ground terminal for the control circuit. 6 fb an inverting input node for the error amplifier and main comparator . see page 22 for how to calculate the resistance of the output voltage setting . 7 freq terminal for setting switching frequency. connecting this termina l to ground makes switching to operate constant on-time corresponding to 2.0mhz . connecting this terminal to avin makes switching to operate constant on-time corre sponding to 1.0mhz. please fix this terminal to avin or ground in operation. 8 mode terminal for setting switching control mode. connecting this term inal to avin forces the device to operate in the fixed frequency pwm mode. connecting this terminal to ground enables the deep-sllm control and the mode is automat ically switched between the deep-sllm control and fixed frequency pwm mode. pl ease fix this terminal to avin or ground in operation. 9 ss terminal for setting the soft start time. the rise time of the ou tput voltage can be specified by connecting a capacitor to this terminal. see pa ge 23 for how to calculate the capacitance . 10, 11, 12 sw switch nodes. these terminals are connected to the source of th e high-side mosfet and drain of the low -side mosfet. connect a bootstrap capacitor of 0.1 f between these terminals and boot terminal. in addition, conne ct an inductor of 0.47 h to 1 h (freq=l), 1 h to 1.5 h (freq=h) considering the direct current superimposition characteristic. 13 boot terminal for bootstrap. connect a bootstrap capacitor of 0.1 f betw een this terminal and sw terminals. the voltage of this terminal is the gate driv e voltage of the high-side mosfet. 14 pgd a p ower g ood terminal, an open drain output. use of pull up resistor is neede d. see page 17 for how to specify the resistance. when the fb terminal volt age reaches more than 80 % of 0.8 v, the internal nch mosfet turns off and the output turns high. 15 en enable terminal. turning this terminal signal low (0.8v or lowe r) forces the device to enter the shutdown mode. turning this terminal signal high ( 2.0v or higher) enables the device. this terminal must be terminated. 16 avin terminal for supplying power to the control circuit of the sw itching regulator. connecting a 0.1 f ceramic capacitor is recommended . this terminal must be connected to pvin. - e-pad a backside heat dissipation exposed pad. connecting to the internal pcb ground plane by using multiple vias provides excellent heat diss ipation characteristics. figure 2. pin assignment (top view) pgnd 4 1 2 3 pvin pgnd ss 9 12 11 10 sw 13 16 15 14 5 6 7 8 agnd freq mode sw sw boot pgd en avin pvin fb e-pad downloaded from: http:///
3/ 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 block diagram(s) figure 3. block diagram control logic + drv vref tsd uvlo on time on time modulation fb mode pgd pgnd sw pvin en vout 3 8 1 5 1 6 1 1 1 4 4 2 1 6 1 0 1 2 avin 5 agnd 9 1 3 boot ss 7 freq pgood soft start error amplifier main comparator hocp locp scp downloaded from: http:///
4/ 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 description of block(s) vref the vref block generates the internal reference voltage. uvlo the uvlo block is for under voltage lockout protection. it will sh ut down the ic when vin falls to 2.45 v (typ) or lower. the threshold voltage has a hysteresis of 100mv (typ). tsd the tsd block is for thermal protection. the thermal protection circ uit shuts down the device when the internal temperature of ic rises to 175 c (typ) or higher. thermal protection circuit resets when the tempe rature falls. the circuit has a hysteresis of 25 c (typ). soft start the soft start circuit slows down the rise of output voltage during start-up and controls the current, which allows the prevention of output voltage overshoot and inrush current. a b uilt-in soft start function is provided and a soft start is initiated in 1msec (typ) when the ss terminal is open. control logic + drv this block is a dc/dc driver. a signal from on time is applied to dri ve the mosfets. pgood when the fb terminal voltage reaches more than 80 % of 0.8 v, the nch mosfet of the built-in open drain output turns off and the output turns high. hocp/locp/scp after soft start is completed and in condition where output voltag e is below 70% (typ) of voltage setting, it counts the number of times of which current flowing in high side fet or low side fet reaches over current limit. when 512 times is counted it stops operation for 1m sec (t yp ) and re-operates. counting is reset when output voltage is above 80% (typ) of voltage setting or when en, uvlo, scp function is re-operated. error amplifier adjusts main comparator input to make internal reference voltage equ al to fb terminal voltage. main comparator main comparator compares error amplifier output and fb terminal volta ge. when fb terminal voltage becomes low it outputs high and reports to the on time block that the output vol tage has dropped below control voltage. on time this is a block which creates on time. requested on time is crea ted when main comparator output becomes high. on time is adjusted to restrict frequency change even with i/o volta ge change. downloaded from: http:///
5/ 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 absolute maximum ratings (ta = 25c) parameter symbol rating unit supply voltage v pvin , v avin -0.3 to +7 v en terminal voltage v en -0.3 to +7 v mode terminal voltage v mode -0.3 to +7 v freq terminal voltage v freq -0.3 to +7 v pgd terminal voltage v pgd -0.3 to +7 v voltage from gnd to boot v boot -0.3 to + 14 v voltage from sw to boot S v boot -0.3 to +7 v fb terminal voltage v fb -0.3 to +7 v sw terminal voltage v sw -0.3 to v pvin + 0.3 v output current i out 4 .5 a operating temperature range topr - 40 to 85 ? c storage temperature range tstg - 55 to 150 ? c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to co nsider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. thermal resistance (note 1) parameter symbol thermal resistance (typ) unit 1s (note 3) 2s2p ( note 4) vqfn016v3030 junction to ambient ja 189.0 57.5 c/w junction to top characterization parameter (note 2) jt 23 10 c/w (note 1) based on jesd 51 -2a(still-air) (note 2) the thermal characterization parameter to report the differe nce between junction temperature and the temperature at the top center of the outside surface of the component package. (note 3) using a pcb board based on jesd 51 - 3. layer number of measurement board material board size single fr -4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70 m (note 4) using a pcb board based on jesd 51 -5, 7. layer number of measurement board material board size thermal via (note 5) pitch diameter 4 layers fr -4 114.3mm x 76.2mm x 1.6mmt 1.20mm 0.30mm top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m (note 5) this thermal via connects with the copper pattern of all layers.. recommended operating conditions (ta= - 40 c to +85 c ) parameter symbol min typ max unit supply voltage v pvin , v avin 2.7 - 5.5 v output current (note 6) i out - - 4 a output voltage range v range 0.8 - v pvin 0. 8 v (note 6) pd, aso should not be exceeded downloaded from: http:///
6/ 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 electrical characteristics (unless otherwise specified ta=25c , v avin = v pvin = 5v, v en = 5 v, v mode = gnd ) parameter symbol min typ max unit conditions avin pin standby supply current i stb - 0 10 a en=gnd operating supply current i cc - 45 80 a freq=avin, i out =0ma no n switching uvlo detection threshold v uvlo1 2.35 2.45 2.55 v v in falling uvlo release threshold v uvlo2 2.425 2.55 2.7 v v in rising uvlo hysteresis v uvlohys 50 100 200 mv enable en input h igh level voltage v enh 2.0 - - v en input low level voltage v enl - - 0. 8 v en input current i en - 5 10 a en=5v reference voltage, error amplifier fb terminal voltage v fb 0.792 0.8 0.808 v fb input bias current i fb - - 1 a fb= 0. 8v internal soft start time t ss 0.5 1.0 2.0 ms ss terminal is open soft start terminal current i ss 0.5 1.0 2.0 a co ntrol freq input high level voltage v frqh v avin -0.3 - - v freq input low level voltage v frql - - 0.3 v mode input high level voltage v modeh v avin -0.3 - - v mode input low level voltage v model - - 0.3 v on time1 ont1 96 120 144 ns v out =1.2v , freq=g nd on time2 ont2 192 240 288 ns v out =1.2v , freq=avin power good power good rising threshold v pgdh 75 80 85 % fb rising , v pgdh =fb/v fb x100 power good falling threshold v pgd l 65 70 75 % fb falling , v pgdl =fb/v fb x100 output leakage current i lkpgd - 0 5 a pgd=5v power g ood o n resistance r pgd - 100 200 power g ood low level voltage p gdv l - 0.1 0.2 v i pgd =1ma sw high side fet o n resistance r onh - 30 60 m boot - sw = 5 v low side fet o n resistance r onl - 30 60 m high side output leakage current r il h - 0 10 a no switching low s ide output leakage current r ill - 0 10 a no switching downloaded from: http:///
7/ 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 typical performance curves 0 10 20 30 40 50 60 -40 -20 0 20 40 60 80 temperature [c] i cc [a] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 80 temperature [c] i stby [a] 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 load current [ma] efficiency[%] 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 load current [ma] efficiency [%] mode=l mode=h mode=l mode=h figure 4. operating supply current vs temperature figure 5. stand- by supply current vs temperature figure 6. efficiency vs load current (v in =5v, v out =1.2v, l=1.0h, freq=l) figure 7. efficiency vs load current (v in =5v, v out =1.2v, l=1.0h, freq=h) v out =1.2v, freq =l v out =1.2v, freq=h v in =5v v in =3.3v v in =5v v in =3.3v downloaded from: http:///
8/ 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 typical performance curves - continued 0.792 0.794 0.796 0.798 0.800 0.802 0.804 0.806 0.808 -40 -20 0 20 40 60 80 temperature [c] v fb [v] 2.36 2.40 2.44 2.48 2.52 2.56 2.60 -40 -20 0 20 40 60 80 temperature [c] v uvlo [v] 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 load current [ma] efficiency [%] 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 load current [ma] efficiency [%] figure 8. efficiency vs load current (v in =5v, v out =3.3v, l=1.0h, freq=l) figure 9. efficiency vs load current (v in =5v, v out =3.3v, l=1.0h, freq=h) figure 10. fb voltage vs temperature figure 11. uvlo threshold vs temperature mode=l mode=h mode=l mode=h v out =3.3 v, freq=l v out =3 .3 v freq=h v in =5v v in =3.3v release detect downloaded from: http:///
9/ 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 typical performance curves - continued figure 14 . freq threshold vs temperature figure 15. freq input current vs temperature figure 12. en threshold vs temperature figure 13. en input current vs temperature 0.5 1.0 1.5 2.0 2.5 3.0 3.5 -40 -20 0 20 40 60 80 temperature [c] v freq [v] v in =5v v in =3.3v 0.0 0.5 1.0 1.5 2.0 2.5 -40 -20 0 20 40 60 80 temperature [c] i freq [a] v in =5v 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -40 -20 0 20 40 60 80 temperature [c] v en [v] up down 0.0 2.0 4.0 6.0 8.0 10.0 -40 -20 0 20 40 60 80 temperature [c] i en [a] v in =3.3v v in =5 v v in =3.3v v in =5.0v v in =5.0v downloaded from: http:///
10 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 typical performance curves - continued 0.5 1.0 1.5 2.0 2.5 3.0 3.5 -40 -20 0 20 40 60 80 temperature [c] v mode [v] 3.0 3.5 4.0 4.5 5.0 5.5 6.0 -40 -20 0 20 40 60 80 temperature [c] i mode [a] 20.0 22.5 25.0 27.5 30.0 32.5 35.0 37.5 40.0 -40 -20 0 20 40 60 80 temperature [c] r onh [m ? ] 20.0 22.5 25.0 27.5 30.0 32.5 35.0 37.5 40.0 -40 -20 0 20 40 60 80 temperature [c] r onl [m ? ] figure 18. high side on-resistance vs temperature figure 19. low side on-resistan ce vs temperature figure 16. mode threshold voltage vs temperature figure 17. mode input current vs temperature v in =5v v in =3.3v v in =5v v in =5v v in =3.3v v in =5v v in =3.3v downloaded from: http:///
11 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 typical performance curves - continued 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 80 temperature [c] i ss [a] 0.0 0.5 1.0 1.5 2.0 -40 -20 0 20 40 60 80 temperature [c] t ss [msec] 60 65 70 75 80 85 -40 -20 0 20 40 60 80 temperature [c] v pgd [%] 60 70 80 90 100 110 120 -40 -20 0 20 40 60 80 temperature [c] p gd on [] figure 22 . soft start time vs temperature figure 23. ss terminal current vs temperature figure 20. pgd threshold vs temperature figure 21. pgd on -resistance vs temperature rising falling v in =5v v in =3.3v v in =5v v in =3.3v v in =5v v in =3.3v downloaded from: http:///
12 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 typical performance curves - continued 800 850 900 950 1000 1050 1100 1150 1200 3.0 3.5 4.0 4.5 5.0 5.5 vin input voltage [v] f sw [khz] 0 200 400 600 800 1000 1200 0 1000 2000 3000 4000 load current [ma] f sw [khz] 0 400 800 1200 1600 2000 2400 0 1000 2000 3000 4000 load current [ma] f sw [khz] 1600 1700 1800 1900 2000 2100 2200 2300 2400 3.0 3.5 4.0 4.5 5.0 5.5 vin input voltage [v] f sw [khz] figure 26 . switching frequency vs input voltage figure 27. switching frequency vs input voltage figure 24. switching frequency vs load current figure 25. switching frequency vs load current mode=l mode=h freq=h v in =5v mode=l mode=h freq=l v in =5v v out =1.2v mode=h freq=l i out =4a v out =1.2v mode=h freq=h i out =4 a downloaded from: http:///
13 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 typical performance curves - continued figure 30 . power up waveform with vin (freq =h , r load =0.3 figure 31 . power down waveform with vin (freq =h , r load =0.3 fi gure 28. power up waveform with en (freq =h , r load =0.3 figure 29. power down waveform with en (freq =h , r load =0.3 time=1ms/div v in =5v/div en=5v/div v out =1v/div sw=5v/div v in =5v/div en=5v/div v out =1v/div sw=5v/div time=1ms/div v in =5v/div en=5v/div v out =1v/div sw=5v/div v in =5v/div en=5v/div v out =1v/div sw=5v/div time=1ms/div time=1ms/div downloaded from: http:///
14 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 typical performance curves - continued figure 35 . switching waveform (v in =5v, v out =1.2v, freq=h, i out =4a) figure 32 . switching waveform (v in =5v, v out =1.2v, freq=l, i out =0.1a) figure 33 . switching waveform (v in =5v, v out =1.2v, freq=l, i out =4a) figure 34 . switching waveform (v in =5v, v out =1.2v, freq=h, i out =0.2a) time=1s/div v out =20mv/div sw=2v/div v out =20mv/div sw=2v/div time=1s/div time=1s/div v out =20mv/div sw=2v/div v out =20mv/div sw=2v/div time=1s/div downloaded from: http:///
15 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 typical performance curves - continued -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 0.0 1.0 2.0 3.0 4.0 load current [a] output voltage deviation[%] -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 vin input voltage[v] output voltage deviation[%] figure 36. line regulation (v out =1.2v, l=1.0 h, freq=h , i out =4a) figure 37. load regulation (v in =5v, v out =1.2v, l=1.0 h, freq=h) figure 38. load transient response i out =0.1a to 3a (v in =5v, v out =1.2v, freq=l, mode=l , c out =ceramic 44f) figure 39. load transient response i out =0.1a to 4a (v in =5v, v out =1.2v, freq=l, mode= h, c out =ceramic 44f) mode=h mode=l mode=l mode=h v out = 50m v/div v out = 50m v/div i out = 2a /div i out = 2a /div time=0.4ms/div time=0.4ms/div downloaded from: http:///
16 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 function explanation(s) 1. basic operation (1) dc/dc converter operation bd 9b400muv is a synchronous rectifying step-down switching regulator that achieves faster transient response by employing constant on-time control system. it utilizes sw itching operation in pwm (pulse width modulation) mode for heavier load, while it utilizes deep-sllm (deep_simple ligh t load mode) control for lighter load to improve efficiency. figure 40 . efficiency (deep-sllm control and pwm control) de ep -sllm control pwm control v out 20mv/div sw 2.0v/div v out 20mv/div sw 2.0v/div pwm control efficiency [%] output current i out [a] deep-sllm control figure 41 . switching waveform a t deep-sllm control (v in =5.0v, v out =1.2v, i out = 10 0ma) figure 42. switching waveform a t pwm control (v in =5.0v, v out =1.2v, i out =4 a) downloaded from: http:///
17 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 (2) enable control the ic shutdown can be controlled by the voltage applie d to the en terminal. when v en reaches 2.0 v(typ), the internal circuit is activated and the ic starts up. to enable shutdown control with the en terminal, the shutdown interval (low level interval of en) must be set to 100 s or l onger. startup by en must be at the same time or after the input of power supply voltage. figure 43 . start up and down with enable (3) power good when the output voltage reaches more than 80% of the volt age setting, the open drain nmosfet, internally connected to the pgd terminal, turns off and the pgd terminal turns to hi-z condition. also when the output voltage falls below 70% of voltage setting, the open drain nmos fet turns on and pgd terminal pulls down with 100. connecting a pull up resistor (10k to 100k is recommended. figure 4 4. power good timing chart (4) soft start when en terminal is turned high, soft start operates and output vo ltage gradually rises. with the soft start function, over shoot of output voltage and rush current can be pre vented. rising time of output voltage when ss terminal is open is 1msec (typ). capacitor connected to ss terminal makes rising time more than 1msec. please refer to page 23 for the method of setting rising time. figure 4 5. soft start timing chart v en 0 v out 0 soft start 1 msec (typ.) v enh v enl en terminal output setting voltage tt en v out pgd voltage setting? 80% voltage setting? 70% en v out fb 0.8 v? 90% 1m sec(typ.) when ss terminal is open 0.8v downloaded from: http:///
18 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 2 . protection the protective circuits are intended for prevention of damage caused by unexpe cted accidents. do not use them for continuous protective operation (1) over current protection (ocp) / short circuit protection (scp) setting (typ) of over current protection are 7a (lower mosfet) a nd 9.5a (upper mosfet) . when ocp is triggered, over current protection is realized by restricting on / of f duty of current flowing in upper and lower mosfet by each switching cycle. also, if over current protection operates 512 cycles in a condition where fb terminal voltage reaches below 70% of internal standard voltage, short circui t protection (scp) operates and stops switching for 1msec (typ) before it initiates re start. however, during startup, short circuit protection will no t operate even if the ic is still in the scp condition. table 1. over current protection / short circuit protection function en terminal pgd startup over current protection short circuit protection more than 2.0v l while start up valid invalid startup completed valid valid h valid invalid less than 0. 8v invalid invalid figure 4 6. shor t circuit protection (scp) timing chart vout fb high side ocp threshold inside ic ocp signal (low side) inside ic ocp signal (high side) pgd 512 cycle low side ocp threshold coil current low side mosfet gate high side mosfet gate 1ms(typ) downloaded from: http:///
19 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 (2) under voltage lockout protection (uvlo) the under voltage lockout protection circuit monitors the avin ter minal voltage. the operation enters standby when the avin terminal voltage is 2.45v (typ) or lower. the operation starts when the avin terminal voltage is 2.55v (ty p) or higher. figure 4 7. uvlo timing chart (3) thermal shutdown when the chip temperature exceeds tj=175 ? c (typ), the dc/dc converter output is stopped. the circuits are automatically restored to normal operation when the chip t emperature falls. it has a hysteresis of 25 ? c (typ). the thermal shutdown circuit is intended for shutting down the ic from thermal runaway in an abnormal state with the temperature exceeding tjmax=150 ? c. it is not meant to protect or guarantee the soundness of t he application. do not use the function of this circuit for application protection d esign. v in 0v v out high side mosfet gate fb terminal soft start hys uvlo off uvlo on normal operation normal operation uvlo low side mosfet gate downloaded from: http:///
20 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 application example(s) en pvin boot freq b d 9 b 4 0 0 m u v pgd sw fb v out avin ss pgd pgnd mode c2 c8 l1 c10 agnd r7 r8 c14 v in c9 c4 r5 figure 48. application circuit table 2 . recommend ed component values (v in =5v, freq=h) reference designator v out description 1. 0v 1.2v 1.5v 1.8v 3.3v r5 100 k 100 k 100 k 100 k 100 k - r7 51 k 75 k 16 0 k 150 k 75 k - r8 2 00 k 150 k 18 0 k 120 k 24 k - c2 (note 7) 22 f 22 f 22 f 22 f 22 f 10v, x5r, 3216 c4 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f 25v, x5r, 1608 c8 (note 8) 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f - c9 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c10 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c14 120 pf 120pf 150pf 150pf 1 80pf - l1 1.0 h 1.0 h 1.0 h 1.0 h 1.0 h toko, fdsd0630 table 3 . recommend ed component values (v in =5v, freq=l) reference designator v out descripti on 1. 0v 1.2v 1.5v 1.8v 3.3v r5 100k 100 k 100 k 100 k 100 k - r7 51 k 75 k 16 0 k 150 k 75 k - r8 2 00 k 150 k 18 0 k 120 k 24 k - c2 (note 7) 22 f 22 f 22 f 22 f 22 f 10v, x5r, 3216 c4 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f 25v, x5r, 1608 c8 (note 8) 0.1 f 0. 1 f 0.1 f 0.1 f 0.1 f - c9 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c10 22 f 22 f 22 f 22 f 22 f 6.3v, x5r, 3225 c14 100 pf 100pf 120pf 120pf 120pf - l1 1.0 h 1.0 h 1.0 h 1.0 h 1.0 h toko, fdsd0630 (note 7) for capacitance of input capacitor take temperature characteristics, d c bias characteristics, etc. into consideration to set minimum value to no less than 10 f. (note 8) for capacitance of bootstrap capacitor take temperature characteri stics, dc bias characteristics, etc. into consideration to set minimum value to no less than 0.047 f. evaluation using the actual machine must be done for above const ant is only a value on our evaluation board. downloaded from: http:///
21 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 selection of components externally connected 1. output lc filte r constant in order to supply a continuous current to the load, the d c/dc converter requires an lc filter for smoothing the output voltage. it is recommended to use inductors of val ues 0.47 h to 1. 0 h when freq=l or 1.0 h to 1.5 h at freq=h. figure 49. waveform of current through inductor figure 50 . output lc filter circuit inductor ripple current il where: v in = 5v v out = 1.2 v l=1.0h f sw =1mhz (switching frequency) the saturation current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor ripple current ?il. the output capacitor cout affects the output ripple voltage characteristics. the output capacitor cout must satisfy the required ripple voltage characteristics. the output ripple voltage can be represented by the following eq uation. where r esr is the equivalent series resistance (esr) of the output capacitor. * the capacitor rating must allow a sufficient margin with respect to the output voltage. the output ripple voltage can be decreased with a smaller esr. a ceramic capacitor of about 22 f to 47 f is recommended. *be careful of total capacitance value, when additional capaci tor c load is connected in addition to output capacitor c out . use maximum additional capacitor c load (max) condition which satisfies the following condition. maximum starting inductor ripple bottom current i lstart can be expressed using the following equation. vout l c out pvin driver ? ? ma 912 = l f v 1 ) v (v v = sw in out in out - l i a(min) limit current over fet side low < il current ripple inductor starting maximum start 5.4 bottom 2 i ) i capacitor( output to current charge + current(i output starting maximum = il l cap ) omax start ? ? v ) f c 8 1 + (r i = v sw out esr l rpl i l average inductor current t i outmax inductor saturation current i outmax + i l / 2 i l downloaded from: http:///
22 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 charge current to output capacitor i cap can be expressed using the following equation. for example, given v in = 5v, v out = 3.3v, l= 1.5h, switching frequency f sw = 1. 2m hz (m ax ), output capacitor c out = 44f, soft start time t ss = 0.5ms(min), and load current during soft start i oss = 4a , maximum c load can be computed using the following equation. if the value of c load is large, and cannot meet the above equation, a dju st the value of the capacitor c ss to meet the condition below. (refer to the following items (3) soft start setting equation of time t ss and soft-start value of the capacitor to be connected to the c ss .) for example, given v in = 5v, v out = 3.3v, l = 1.5h, load current during soft start i o ss = 4 a, switching frequency f sw = 1.2mhz (m ax ), output capacitor c out = 44 f, v fb = 0.792 v( max) , i ss = 3.6a(max) , with c load = 220uf , capacitor c ss is computed as follows. c load has an effect on the stability of the dc/dc converter. to ensure the stability of the dc/dc converter, make sure that a suffic ient phase margin is provided. 2. output voltage setting the output voltage value can be set by the feedback resistanc e ratio. for stable operation, it is recommended to use feedback resista nce r1 of more than 20k . figure 51 . feedback resistor circuit v out r1r2 fb error amplifier 0.8v ? ? v 0.8 r2 r2 + r1 = v out [ ] a ss out load out cap t v ) c + (c = i ? ? f 78.9 c- v t /2) i i- (4.5 < (max) c out out ss l oss load ? ? ? ? out r1 0.8 - v 0.8 = r2 out ss ss out fb l oss load c- c i v v /2) i i- (4.5 < (max) c ? ? ? pf 2710 = ) c + (c v /2) i i- (4.5 i v > c out load fb l oss ss out ss ? downloaded from: http:///
23 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 3. soft start setting turning the en terminal signal high activates the soft start function. this causes the output voltage to rise grad ually while the current at startup is placed under control. this allows t he prevention of output voltage overshoot and inrush current. the rise time depends on the value of the capacitor con nected to the ss terminal. turning the en terminal signal high with the ss terminal open o r with the terminal signal high (no capacitor connected) causes the output voltage to rise in 1msec (typ). 4. fb capacitor generally, in fixed on time control (hysteresis control), su fficient ripple voltage in fb voltage is needed to ope rate comparator stably. regarding this ic, by injecting ripple vol tage to fb voltage inside ic it is designed to correspond to low esr output capacitor. please set the fb capacitor within the range of the following expression to inject an appropriate ripple. [msec] ] f [ [v] ] f [ ] f [ with current source terminal start soft (typ)) (0.8v voltage terminal fb terminal time start soft to connected capacitor time start soft 8.0 = /1.0 0.8 (0.01 = t 0.01 = c i v c t )/v t (i = c )/i v (c = t ss ss ss fb ss ss fb ss ss ss ss fb ss ss ) , : : : : )) (1.0a(typ frequency switching voltage output voltage input : : : sw out in sw in out out fb sw in out out f v v 10 3.3 f ) v v - (1 v < c < 10 7.65 f ) v v - (1 v 3 3 downloaded from: http:///
24 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 pcb layout design in the step-down dc/dc converter, a large pulse current flows into two loo ps. the first loop is the one into which the current flows when the high-side fet is turned on. the flow starts from th e input capacitor c in , runs through the fet, inductor l and output capacitor c out and back to gnd of c in via gnd of c out . the second loop is the one into which the current flows when the low-side fet is turned on. the flow starts from the low -side fet, runs through the inductor l and output capacitor c out and back to gnd of the low -side fet via gnd of c out . route these two loops as thick and as short as possible to allow noise to be reduced for improved effi ciency. it is recommended to connect the input and output c apacitors directly to the gnd plane. the pcb layout has a great influence on the dc/dc converter in terms of all of the heat generation, noise and efficiency characteristics. accordingly, design the pcb layout considering the following points. ? connect an input capacitor as close as possible to the ic pvin terminal on t he same plane as the ic. ? if there is any unused area on the pcb, provide a copper foil pla ne for the gnd node to assist heat dissipation from the ic and the surrounding components. ? switching nodes such as sw are susceptible to noise due to ac coupling with other nodes. route the coil pattern as thick and as short as possible. ? provide lines connected to fb far from the sw nodes. ? place the output capacitor away from the input capacitor in orde r to avoid the effect of harmonic noise from the input. figure 52. current loop of buck converter c in mos fet c out v out l v in downloaded from: http:///
25 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 i/o equivalence circuit(s) 6. fb 7. freq 8. mode 9. ss 10.11.12. sw 13. boot 14. pgd 15. en ss avin 10k 10k 10k sw pvin boot boot pvin sw pgd avin fb avin 10k freq avin avin 100k en 390k 470k 140k mode avin avin 100k 1000k downloaded from: http:///
26 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting t he analog block. furthermore, connect a capacitor to ground at all power s upply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the groun d pin at any time, even during transient condition. however, pins that drive inductive loads (e.g. motor driver ou tputs, dc-dc converter outputs) may inevitably go below ground due to back emf or electromotive force. in su ch cases, the user should make sure that such voltages going below ground will not cause the ic and the system t o malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply volta ge, operating frequency and pcb wiring to name a few. 4. ground wiring pattern when using both small-signal and large-current ground tra ces, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-sign al ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature ratin g be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current m ay flow instantaneously due to the internal powering sequenc e and delays, especially if the ic has more than one pow er supply. therefore, give special consideration to power coupl ing capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. te sting on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ics power supply sh ould always be turned off completely before connecting o r removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each o ther especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal parti cles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during as sembly to name a few. downloaded from: http:///
27 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos tra nsistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l ch arge acquired in this way is enough to produce a signific ant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutua l interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes t o operate, such as applying a voltage lower than the gnd v oltage to an input pin (and thus to the p substrate) shou ld be avoided. figure 53. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric co nstant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and p ower dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that preven ts heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ra ting is exceeded for a continued period, the junction te mperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circu it that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous ope ration or transitioning of the protection circuit. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
28 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 ordering information b d 9 b 4 0 0 m u v - e 2 part number package vqfn016v3030 packaging and forming specification e2: embossed tape and reel marking diagrams vqfn016v3030 (top view) d 9 b 4 0 0 part number marking lot number 1pin mark downloaded from: http:///
29 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 physical dimension, tape and reel information package name vqfn016v3030 downloaded from: http:///
30 / 30 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD9B400MUV tsz02201-0j3j0aj01200-1-2 22.apr.2016 rev.002 revision history date revision changes 1.mar. 2016 001 new release 22.apr.2016 002 p age. 5 thermal resistance - footprints and traces 74.2mm 2 (square) ? 74.2mm x 74 .2 mm downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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